A Compact Trench-Assisted Space-Modulated JTE Design for High-Voltage 4H-SiC Devices

نویسندگان

چکیده

This article proposes a compact trench-assisted space-modulated junction termination extension (TSM-JTE) design for high-voltage 4H-silicon carbide (SiC) devices. In this design, trench structures are introduced into the JTE region to effectively split three functional zones. The proposed structure is cost effective in terms of chip area it occupies; devices rated at 10 kV, extends edge device by only 250 μm. Requiring one implant, relatively cheap fabricate, while wide implantation dose window endures that insensitive variations may occur during processing. same advantages 20 TSM-JTE proving have best tradeoff between maximum breakdown voltage and window, compared with other single implant designs, achieving 500 μm length. At 3.3 110-μm retains its over but floating field rings expected consume less area, though not case higher voltages.

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ژورنال

عنوان ژورنال: IEEE Transactions on Electron Devices

سال: 2021

ISSN: ['0018-9383', '1557-9646']

DOI: https://doi.org/10.1109/ted.2020.3047348